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Audited Supplier MAGNETRON SPUTTERING: OVERVIEW
Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These atoms travel towards the substrate and incorporate into the growing film.
Magnetron sputtering coating equipment is a special laboratory coating instrument developed by our company. The equipment can be equipped with DC power supply and RF power supply. The power ranges from 500W to 1000W. It can be used to prepare single or multilayer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, etc.
New design four target magnetron sputtering coater with max.800C sample hetaing
Compared with the conventional plasma sputtering, magnetron sputtering has the advantages of high energy, high speed, high deposition rate and low sample temperature rise. The magnetron target is equipped with water-cooled interlayer. The water cooler can effectively take away heat and avoid heat accumulation on the target surface, so that the magnetron coating can work stably for a long time.
Specifications of four target magnetron sputtering coater
| Coating vacuum system |
Vacuum assembly |
60m3/h mechanical pump and KYKY1600L molecular pump to form the pumping system and equipped with high- precision composite vacuum gauge to measure and monitor the vacuum degree in realtime; |
Pumping time |
After the system is exposed to the atmosphere for a short time and filled with dry nitrogen, then pumping begins. The vacuum degree is less than 5×10-4Pa within 30 minutes, and the vacuum degree is less than 5Pa after the system stops pumping and shuts down for 12 hours; | |
| Ultimate vacuum |
≤6×10-5Pa | |
| Valve assembly |
Pre-extraction valve DN40, electric main valve CF200, DN16 vent valve, DN40 solenoid valve and various vacuum lines, etc. (the above valves are pneumatic or electric) | |
| Vacuum automatic constant pressure |
The equipment can quickly reach the high vacuum, and can be automatically adjusted in real time when the required vacuum degree is reached after the process air intake, so as to maintain a stable vacuum degree, reduce the process to a high degree, and ensure the repeatability of the prepared sample. | |
| Magnetron sputtering generation and control reaction system |
Coating chamber limit vacuum |
≤6×10-5Pa; System vacuum leak detection rate: ≤8.0×10-7 Pa.l/S |
| Vacuum chamber size |
500x500x420mm, | |
| Gas type | Argon, nitrogen, hydrogen, oxygen | |
| Substrate size as well as functional components |
Substrate sizes of Φ4 inches (compatible with small sizes) can be placed; Substrate rotation range: 5~60 RPM adjustable; Substrate heating: Max.800±1ºC, controlled by thermocouple closed-loop feedback (i.e. PID temperature control) |
|
| Cooling method |
Water cooling | |
| Sputter deposition and control system | Control system |
PLC+ PC software coating machine control system |
| Constant pressure working intake of air |
Use a thin film vacuum gauge for measurement |
|
| Measuring range |
3 Pa 0.013 Pa | |
| Target number size, |
4 2-inch sputter targets | |
| Target Spacing |
The four targets are sputtered vertically upward, and the distance between the target and the sample is adjustable | |
Power Supply |
2 sets of 500W RF sputtering power supply(automatic matching), 2 sets of 500W DC sputtering power supply, 1 set of 500W bias power supply (improve the density and uniformity of the film layer, and have sputtering cleaning function) | |
| Process air Intake assembly |
Two-way MFC mass flow meter controls gas flow (0-100SCCM, 0-200SCCM), accurate to 0.1 sccm adjustable | |
| Evenness | The uniformity of the inner membrane thickness of the 4-inch diameter wafer sample is less than 3%, and the error between the center point and the edge thickness is less than 3% | |
| Other | Supply voltage |
AC220V,50Hz |
| Overall dimensions |
600mm X 650mm X 1280mm | |
| Machine weight |
350kg | |
| Machine power |
4KW |
1. WE have magnetron sputtering coater with 1 target, 2 targets, 3 targets, target can be designed at the top or bottom of
the chamber.
2. 0-1000W DC power or RF power target is available. Bias function is optional
4. Strong magnetic target and Pernanent magenetic target is optional
5. Magnetron sputtering coater with evaporation, e-beam is available
6. Customized service is always available!
WE can ship the magnetron sputter coater by land, by sea, by air, by express, also can arrange package and shipment according to your requirements.
Q. Are you manufacturer or trading company?
A. We are professional manufacturer of laboratory instruments, We have professional R&D team and workshop, which can promise the qulaity and after-sale service.
Q. How's your warranty?
A. Our warranty is 12 months, and provide lifetime maintenance. We provide 24 hours on-line service.
Q. How long is your delivery time? If I want to customize the instrument, how long does it take?
A. 5-10 days----in store. Customzied products---It usually takes 30-60 days depending on your requirements.
Q. Power supply and plug?
A. We can provide products accroding to your local voltage and plug standard.
Q. How to pay?
A. T T, L / C, D / P, etc.
Q. How is the package of goods? Delivery methods?
A. Standard export fumigation sign wooden box packaging or as your requirements.
IS MAGNETRON SPUTTERING THE RIGHT PROCESS FOR YOUR WORK?
Please get in touch and we can collaborate on your project.
How can we help you achieve your goals? What technical obstacles can our engineering team help you overcome? Please press the 'Get in Touch' button to get in contact with us, we'd be excited to hear about your research and help you in any way we can.
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